Apple iPhone 8 Plus

Board Shots

Baseband

The XMM7480 (PMB9948) modem die size is 7.70mm x 9.15mm (70.45mm2), bigger than the previous generation XMM7360 (PMB9943) which is 7.71mm x 8.47mm (65.30mm2).  Please contact TechInsights for the upcoming Intel XMM7480 (PMB9948) Modem Digital Functional Analysis Report (FAR-1709-803).

RF Transceiver

The Transceiver is new Intel Trx, the PMB5757.  After comparing the die photos of the Intel PMB5757 RF Transceiver to the previous PMB5750 used in the iPhone 7/7 Plus, it appears that Intel has re-used most of the previous chip. The two dies are in the same die size and they are almost identical except for minor changes in the left column and bottom row of repeated cells.

NFC Controller

We were not too surprised to find a NXP NFC module in the iPhone 8 Plus. This one has package markings ‘80V18’. This is different from the PN67V we found in the iPhone 7 Plus.

Wi-Fi/BT Module

Universal Scientific Industrial (USI) 339S00397 Wi-Fi/Bluetooth module.

the Broadcom BCM4361, and our analysis has confirmed that we are correct. Broadcom wins the wireless combo socket. 

TechInsights previously analyzed the Broadcom BCM4361 wireless combo SoC when we found it in our Samsung Galaxy S8 analyses.

BCM4361, TechInsights has also analyzed other Bluetooth 5.0 SoCs, including Texas Instruments CC2640R2F, Qualcomm WCN3990, and a dialog DA14586.  

TechInsights has completed Digital Functional Analysis on the  Broadcom BCM4361 (die BCM43570).

Audio ICs​ 

We see three 338S00295 Audio Amplifiers.  They should be from Apple/Cirrus Logic.  The 338S00248 is the Audio Codec from Apple/Cirrus Logic too.

USB Interface

A Cypress EZ-PD™ CCG2 USB Type-C Port Controller is found in the iPhone 8 Plus. We decoded the part number as CYPD2104. The chip enables fast charging for the iPhone when coupled with a compatible accessory Apple USB-C power adapter (29W Model A1540). We have already seen it in the iPad Pro 10.5 ‘’ in June 2017.